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Product Brief
PMB 8877
S - G O L D 3 TM - T u r b o E n g i n e f o r EDGE-enabled Multimedia Phones
S - G O L D 3 T M T A K E S Infineon Technology's well-known S-GOLD (R) architecture to new performance spheres. Its performance-optimized implementation nearly doubles the multimedia power of previous S-GOLD (R) controllers. High processor speed combined with multimedia hardware accelerators and advanced connectivity make this device the "turbo engine" of the S-GOLD (R) family. Even the most performance-greedy applications such as video telephony and 3D graphics can easily be handled without additional hardware. S-GOLD3 TM's proven architecture known as "application-enhanced modem" is extremely efficient with respect to overall system cost, footprint, feature set, power consumption, and application performance. Its EDGE capable modem marks the third generation of Infineon's EDGE-enabled baseband solutions. Configurable with a UMTS co-processor, S-GOLD3 TM extends into the growing 3G market, offering easy migration from a GSM/GPRS/EGPRS phone to a dual-mode wideband CDMA/GSM terminal. A S N E X T - G E N E R A T I O N mobile phones go further and further beyond pure communication functionality, S-GOLD3 TM offers costoptimized access to multimedia functions such as camera support of up to 5 MPixel (with JPEG camera module), video replay up to 15 fps/CIF resolution, video streaming over EDGE in MPEG4/H.264/Real format, video recording, and advanced audio codecs like AAC++. Supporting all this functionality without the need for additional hardware, S-GOLD3 TM enables a true 3-chip system solution with minimum cost and size requirements. For even more demanding feature need S-GOLD3 TM is configurable with a number of co-devices such as multimedia companion chips and/or WCDMA co-modem for 3G feature phones. S - G O L D 3 ' S O V E R A L L S Y S T E M performance is based on the outstanding processor speed of its ARM (R)926 CPU which is tailored to run at up to 312 MHz. Data and instruction caches as well as general-purpose zero-wait-state memories allow for fast memory access, fully exploiting the processing power of the CPU core. To keep power consumption at a minimum several power measures control the activation, the frequency selection, and the power-down modes of the various on-chip resources. To enable efficient access to external memory devices S-GOLD3 TM allows for low-latency access to a number of memory types such as NOR/NAND Flash, SDRAM, cellular RAM, PSRAM. DDR SDRAMs can be operated "high speed", transferring data twice per clock cycle. C O M B I N E D W I T H Infineon's latest SMARTi TM RF devices and SM-POWER TM power management ICs, S-GOLD3 TM comprises the system solution for next-generation, EDGE-enabled mobile phones with minimum bill-of-material and space constraints.
TM
Key Application Features

ARM (R)926 based single modem and application processor with cache support and fast tightlycoupled memories Parallel/serial display interface supporting high resolution color displays High-speed serial display interface for costeffective clam-shell mechanics Camera interface supporting camera applications of up to 5 MPixel MPEG4/H.263 accelerator hardware (MOVE (R) coprocessor) 2x MMC/SD interfaces, SD IO capable USB 2.0 on-the-go, full speed Fast IRDA Dedicated NAND flash controller supporting burst mode and error detection Standardized multimedia extension interface (MMIC-IF) supporting external hardware accelerator ICs such as complex display/camera modules or graphic accelerators 2 bi-directional digital audio interfaces (I 2S) to connect audio companion ICs and Bluetooth modules Support for video streaming + video telephony Support of DDR-SDRAM devices
Key Modem Features

E-GPRS/GPRS/GSM modem supporting up to multislot class 12 FR, HR, EFR, AMR HSCSD class 10 SAIC DTM class 11 Polyphonic Ringer support for up to 64 voices at up to 48 kHz sampling rate Echo cancellation/noise reduction GTT/TTY
www.infineon.com/mobilesolutions
Mobile Solutions
Product Brief
Application Example Quad-Band EGPRS Solution
I2S SRC I S / DAI
1 Wire USB FS OTG Keypad GPIOs
SIM
2
Equalizer Acc. Channel Decoder
DSP Timer DSP ICU
S-GOLD3
(PMB 8877)
RF Control IF
GSM Cipher Unit
3-wire-bus
3 Wire IF
SMARTi-PM
(PMB 6272)
(EDGE GSM/GPRS RF Transceiver)
D A D IF I/Q Ph/ Amp
A
PA FEM
TEAKLite
JTAG ABW
(R)
BB Receiver 8 PSK/GMSK Modulator Audio FE
A D A D CGU AUX ADC SPCU Sys Timer
D A D A AFC GSM Timer Analog Audio In Analog Audio Out
SD PLL
IR-Memory Cerberus
1 4 7 *
2 5 8 0
3 6 9 #
SRAM
DMAC ICU
DCXO
GEA-1/2/3 CAPCOM
1.8 V, 2.5 V SU USB Flash Light VPLL VUSB VAUDIOs VAUX VRTC LDOs Audio Amplifier VIO VMMC VRFs VVIB VSIM VAFC Charger
ARM(R)926 EJ-S
GPTU
I2C
MEM CTRL FCDP Core Supply (0.95 V, 1.37 V) Analog Supply (2.5 V) VRTC, VPLL, IO Supply
SM-Power3
(PMB 6821)
USIM Fast IrDA MMC IF 2D Engine SDIO IF Crypto Box USIFs
MOVE CoPro
RTC
SD MMC
Multimedia IC IF TSMU Display IF Camera IF
I 2C SDs Dig. Reset & Sleep Control Backlight Reference Digital Control
NOR / NAND FLASH
SDR or DDR SDRAM / C-RAM
Applications

Key Benefits
E-GPRS/GPRS/GSM multimedia phones with tomorrow's multimedia requirements Minimum space E-GPRS/GPRS data modules supporting up to multislot class 12 WCDMA phone and data module applications (in combination with WCDMA co-processor)

High integration level of key multimedia features allowing for minimum cost system solutions for tomorrow's feature phones High overall system performance with high-speed ARM subsystem and double-data rate memory access Proven leading-edge modem technology with third generation E-GPRS evolution Feature flexibility through upgrade options with multimedia chips via standardized interface 3G upgradeable with WCDMA coprocessor Connectivity to Bluetooth, FM Radio, WLAN, A-GPS and other modules
Note: TEAKLite (R) is a registered trademark of ParthusCeva, Ltd. ARM (R) is a registered trademark of ARM, Ltd.
How to reach us: http://www.infineon.com Published by Infineon Technologies AG 81726 Munchen, Germany (c) Infineon Technologies AG 2006. All Rights Reserved.
Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office.
Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in lifesupport devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.
Published by Infineon Technologies AG
Ordering No. B134-H8540-G1-X-7600 Printed in Germany PS 01061. nb

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